![]() | Dielectric Films for Advanced Microelectronics This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films. Karen Maex , IMEC Fellow, Silicon Process and Device Technology Division, Leuven, Belgium & Professor at Katholieke Universiteit Leuven Mikhail R. Baklanov , Principal Scientist, Silicon Process and Device Technology Division, IMEC, Leuven, Belgium IMEC is the largest independent microelectronics R&D centre in Europe, with over 1250 staff. R&D ranges from the design of complex single-chip and single-package systems for telecommunications and multimedia, new process technologies for optoelectronics, photovoltaics, area-array packing, etc. |
![hidden image for function call](https://upload.wikimedia.org/wikipedia/commons/c/ca/1x1.png)